Services
Services
Microelectronics Assembly Services
TPT provides a range of Wire Bonding and Die Bonding services from application support to prototype and small batch production.
Our company also offers wire pull and shear test to enable qualification of the bond process.
Our company also offers wire pull and shear test to enable qualification of the bond process.
Microelectronics Assembly Services
TPT provides a range of Wire Bonding and Die Bonding services from application support to prototype and small batch production.
Our company also offers wire pull and shear test to enable qualification of the bond process.
17-500µm
Wire Diameter
Wires
Gold and Aluminum
Die Bonding
Placing Microchips
Pull Test
Bond Qualification
Shear Test
Bond Qualification
17-500µm
Wire Diameter
Wires
Gold and Aluminum
Die Bonding
Placing Microchips
Pull Test
Bond Qualification
Shear Test
Bond Qualification
