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for development
and production of microchips

TPT Wire Bonder - Wire Bonder - Drahtbonder HB16

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for placing microchips

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Overview Wire and Die Bonders

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BONDING EXPERTS

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Made in Germany

NEUSCHWANSTEIN Munich City

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Trade Fair Time is Travel Time.

Tobias Hickmann

have a look at our bonders live -
for example at
World’s leading trade fair
for electronics development and production

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Heater Stages and Work Stages

Bond Tools
and Wires

Applications
Wedge and Ball bonding

TPT Service
Video Trainings and Demos

TPT Wire Bonder

Assembly Services

For more information
contact us!

HB05 Wire Bonder

Download Datasheet HB05

HB16 Wire Bonder

with motorized
Z- & Y- Axis

Download Datasheet HB16

HB100 Automatic
Wire Bonder

with motorized Z-Y-X Axis and Bond Head Rotation

Download Datasheet HB100

HB30 Heavy
Wire Bonder

with motorized
Z- & Y- Axis

Download Datasheet HB30

HB75 Die Bonder

with motorized
Z - Axis

Download Datenblatt HB75

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Applications

TPT Wire Bonder - Wire Bonder - Drahtbonder - Die Bonder - Service Mikroelektronik Bond Dienstleistungen Microelectronics Assembly Services

Services

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Heaterstages

TPT Wire Bonder - Wire Bonder - Drahtbonder - Die Bonder - Service Mikroelektronik Bond Dienstleistungen Microelectronics Assembly Services Bonding Wire Bonddraht

Tools

TPT wire bonder are made in Germany
and are used in the development and production of microchips.

Bonding Experts

Our goal is to support developers in realizing new ideas and applications for microelectronics. Our customers are startups, universities and large corporations, in more than 60 countries around the globe.

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TPT and its Distribution Partners

Global, Competent, Family

Wire Bonding with the HB100Wedge Bonding
Ball Bonding
Bump Bonding

Microelectronics Assembly

TPT Services