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18. - 21. Nov. 2025 - Munich / Germany

Tobias Hickmann

Visit us at booth 304, hall B2

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for development
and production of microchips

TPT Wire Bonder - Wire Bonder - Drahtbonder HB16

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Overview Wire and Die Bonders

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BONDING EXPERTS

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with motorized Z-Y-X axes
and bond head rotation

TPT Wire Bonder - Wire Bonder - Drahtbonder HB100

AUTOMATIC WIRE BONDER

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with motorized
Z- & Y- axes

Wire Bonder - Drahtbonder Made in Germany, TPT Wire Bonder - Die Bonder Made in Germany,

HEAVY WIRE BONDER

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for placing microchips

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Wire Bonder - Drahtbonder Made in Germany, TPT Wire Bonder - Die Bonder Made in Germany,

Made
in
Germany

Munich City NEUSCHWANSTEIN OKTOBERFEST

Heater Stages and Work Stages

Bond Tools
and Wires

Applications
Wedge and Ball bonding

TPT Service
Video Trainings and Demos

TPT Wire Bonder

HB02 Wire Bonder

Download Datasheet HB02

HB05 Wire Bonder

wedge-wedge & ball-wedge

Download Datasheet HB05

HB16 Wire Bonder

with motorized
Z- & Y- Axis

Download Datasheet HB16

HB100 R&D
Wire Bonder

with all Axes motorized and Bond Head Rotation

Download Datasheet HB100 R&D

HB100 Automatic
Wire Bonder

with motorized Z-Y-X Axis and Bond Head Rotation

Download Datasheet HB100

HB30 Heavy
Wire Bonder

with motorized
Z- & Y- Axis

Download Datasheet HB30

HB75 Die Bonder

with motorized
Z - Axis

Download Datenblatt HB75

Assembly Services

For more information
contact us!

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Applications

TPT Wire Bonder - Wire Bonder - Drahtbonder - Die Bonder - Service Mikroelektronik Bond Dienstleistungen Microelectronics Assembly Services

Services

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Heaterstages

TPT Wire Bonder - Wire Bonder - Drahtbonder - Die Bonder - Service Mikroelektronik Bond Dienstleistungen Microelectronics Assembly Services Bonding Wire Bonddraht

Tools

Wire Bonding
Technologie

For decades ultrasonic and thermosonic wire bonding has become one of the most important processes in microelectronic packaging, due to its high flexibility and cost-efficiency. It is used to interconnect all kinds of microelectronic parts like semiconductor devices, chips, LEDs, PCBs, and so on. The process itself uses ultrasonic, pressure, and temperature to weld metal wires to dedicated bonding pads. The intermetallic connection is made without melting the materials, therefore wire bonding is referred to as “cold welding process”. There is a numerous amount of wires and tools available matching all kinds of specific needs. To match the technical needs of the finest IC up to high-power electronics, the wire bonding spectrum reaches from ultra-thin round wires (12 µm diameter) to heavy ribbon wires with cross sections of up to 200x2000 µm2. While wedge-wedge bonding is available for heavy and thin wire bonding, the ball-wedge bonding process is exclusively done with thin wires.

TPT Applications

TPT wire bonder are made in Germany
and are used in the development and production of microchips.

Bonding Experts

Our goal is to support developers in realizing new ideas and applications for microelectronics. Our customers are startups, universities and large corporations, in more than 60 countries around the globe.

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TPT and its Distribution Partners

Global, Competent, Family

Wire Bonding with the HB100Wedge Bonding
Ball Bonding
Bump Bonding

Microelectronics Assembly

TPT Services

Wire Bonding

Wire Bonding Technologie

For decades ultrasonic and thermosonic wire bonding has become one of the most important processes in microelectronic packaging, due to its high flexibility and cost-efficiency. It is used to interconnect all kinds of microelectronic parts like semiconductor devices, chips, LEDs, PCBs, and so on. The process itself uses ultrasonic, pressure, and temperature to weld metal wires to dedicated bonding pads. The intermetallic connection is made without melting the materials, therefore wire bonding is referred to as “cold welding process”. There is a numerous amount of wires and tools available matching all kinds of specific needs. To match the technical needs of the finest IC up to high-power electronics, the wire bonding spectrum reaches from ultra-thin round wires (12 µm diameter) to heavy ribbon wires with cross sections of up to 200x2000 µm2. While wedge-wedge bonding is available for heavy and thin wire bonding, the ball-wedge bonding process is exclusively done with thin wires.

Go to Applications