and production of microchips WIRE BONDER
for example at
World’s leading trade fair
for electronics development and production
TPT Wire Bonder
For decades ultrasonic and thermosonic wire bonding has become one of the most important processes in microelectronic packaging, due to its high flexibility and cost-efficiency. It is used to interconnect all kinds of microelectronic parts like semiconductor devices, chips, LEDs, PCBs, and so on. The process itself uses ultrasonic, pressure, and temperature to weld metal wires to dedicated bonding pads. The intermetallic connection is made without melting the materials, therefore wire bonding is referred to as “cold welding process”. There is a numerous amount of wires and tools available matching all kinds of specific needs. To match the technical needs of the finest IC up to high-power electronics, the wire bonding spectrum reaches from ultra-thin round wires (12 µm diameter) to heavy ribbon wires with cross sections of up to 200x2000 µm2. While wedge-wedge bonding is available for heavy and thin wire bonding, the ball-wedge bonding process is exclusively done with thin wires.