Heater Stages and Work Stages

Bond Tools
and Wires

Applications
Wedge and Ball bonding

TPT Service
Video Trainings and Demos

TPT Wire Bonder

HB05 Wire Bonder

fully manual

Download Datasheet HB05

HB16 Wire Bonder

with motorized
Z- & Y- Axis

Download Datasheet HB16

HB100 Automatic
Wire Bonder

with motorized Z-Y-X Axis and Bond Head Rotation

Download Datasheet HB100

HB30 Heavy
Wire Bonder

with motorized
Z- & Y- Axis

Download Datasheet HB30

HB75 Die Bonder

with motorized
Z - Axis

Download Datenblatt HB75

FP_Mobile_Anwendungen_mit_BG_675_675

Applications

TPT Wire Bonder - Wire Bonder - Drahtbonder - Die Bonder - Service Mikroelektronik Bond Dienstleistungen Microelectronics Assembly Services

Services

FP_Mobile_Heiztische_03_mit_BG_675_675

Heaterstages

TPT Wire Bonder - Wire Bonder - Drahtbonder - Die Bonder - Service Mikroelektronik Bond Dienstleistungen Microelectronics Assembly Services Bonding Wire Bonddraht

Tools

TPT wire bonder are made in Germany
and are used in the development and production of microchips.

Bonding Experts

Our goal is to support developers in realizing new ideas and applications for microelectronics. Our customers are startups, universities and large corporations, in more than 60 countries around the globe.

TPT and its Distribution Partners

Global, Competent, Family

Wire Bonding with the HB100Wedge Bonding
Ball Bonding
Bump Bonding

Microelectronics Assembly

TPT Services