for development and production of microchips WIRE BONDER for placing microchips DIE BONDER Overview Wire and Die Bonders BONDING EXPERTS Trade Fair Time is Travel Time. Tobias Hickmann have a look at our bonders live - for example at World’s leading trade fair for electronics development and production Exhibitions OKTOBERFEST Made in Germany NEUSCHWANSTEIN Munich City OKTOBERFEST NEUSCHWANSTEIN Munich City Made in Germany Munich City Heater Stages and Work Stages Bond Tools and Wires Applications Wedge and Ball bonding YouTube Channel Applications & explanations TPT Wire Bonder HB05 Wire Bonderfully manualDownload Datasheet HB05 HB16 Wire Bonderwith motorized Z- & Y- AxisDownload Datasheet HB16 HB100 Automatic Wire Bonderwith motorized Z-Y-X Axis and Bond Head RotationDownload Datasheet HB100 HB30 Heavy Wire Bonderwith motorized Z- & Y- AxisDownload Datasheet HB30 HB75 Die Bonderwith motorized Z - AxisDownload Datenblatt HB75 Applications Read MoreHeaterstages Read MoreTPT wire bonder are made in Germany and are used in the development and production of microchips.Bonding ExpertsOur goal is to support developers in realizing new ideas and applications for microelectronics. Our customers are startups, universities and large corporations, in more than 40 countries around the globe. TPT and its Distribution PartnersGlobal, Competent, FamilyAbout TPT Read MoreDistributors Read More Wire Bonding with the HB100Wedge Bonding Ball Bonding Bump Bondinginfo@tpt.deYoutube Channel Close | ✕ By loading the video, you agree to YouTube's privacy policy.Learn moreLoad video Always unblock YouTube
