HB16
Wire Bonder
with motorized
Z- & Y - Axes
HB16 Wire Bonder
with motorized Z- & Y - Axes
Our goal is to support developers in realizing new ideas and applications for microelectronics. Our customers are startups, universities and large corporations, in more than 40 countries around the globe.
Touch Screen
Easy Handling
and Control
with the 6,5" TFT
One Bond Head
for Wedge,
Ball, Bump,
& Ribbon
Deep & Wide
Bond Access - Ample work-
space due to Special
Bond Head Design
Touch Screen
Easy Handling
and Control
with the 6,5" TFT
Our long tested 6,5“control panel provides you with an intuitive entry bonding with our product. All processes are visible for you at any time.
One Bond Head
for Wedge,
Ball, Bump,
& Ribbon
With our machines there is no need to change the bond head, no matter the application. Just switch tool tips, fast and easy. All bonding modes are at your disposal any time.
Deep & Wide
Bond Access - Ample
workspace due to Special
Bond Head Design
We install extra-long bond arms/transducer in all our bonders. Further is the clamp and its screw installed on top of the tool instead of behind it. This unique combination is the key to access narrow spaces directly in the housing of your application.
PT Option
Pass-Through
for
wide casings
H98
High Option
for
high components
PT Option
Pass-Through for wide casings
On request, we adapt the basic structure of our machines to the specifics of your application. For example, a pass-through machine base for very deep or wide cases.
H98
High Option for high components
With option H98, the bond height will be switched from 76 mm to 100, 125, 150 mm or any other height you might need.
17µm to 75µm Wire
gold, aluminum, silver
& copper wire
One Bond Head
wedge-, ball-, bump-
& ribbon bonding
Repeatable Loop Profiles
motorized axis allows
precise loop repetition
Touch Screen
easy handling and control
with the 6,5″ TFT
Automatic Bond Height Adjustment
z-axis sensor identifies touch down
and sets height parameters
Simple Loop Programming
create individual loop profiles
consisting of up to 10 steps
Storage of 100 parameters
easy setting recall for working
on different applications
Deep & Wide Bond Access
ample workspace due to
special bond head design
