HB05
Wire Bonder

manual

Our HB05 gives you an easy access to the topic of bonding.
Look, aim, bond - done.

HB05 Wire Bonder

fully manual

Our HB05 gives you an easy access to the topic of bonding.
Look, aim, bond - done.

4“ TFT

Multibutton Display
Fast Access
to all parameters

Our long tested 6,5“control panel provides you with an intuitive entry bonding with our product. All processes are visible for you at any time.

One Bond Head

for Wedge,
Ball, Bump,
& Ribbon

With our machines there is no need to change the bond head, no matter the application. Just switch tool tips, fast and easy. All bonding modes are at your disposal any time.

Deep & Wide

Bond Access - Ample
workspace due to Special
Bond Head Design

We install extra-long bond arms/transducer in all our bonders. Further is the clamp and its screw installed on top of the tool instead of behind it. This unique combination is the key to access narrow spaces directly in the housing of your application.

HB05

Fully Manual ideal for laboratories and pilot production lines

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17μm to 75μm Wire

gold, aluminum, silver & copper wire

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One Bond Head

wedge, ball, bump & ribbon bonding

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Light Weight

weighs in total only 29kg

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Compact Design

smooth and easy use

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4“ TFT

fast and easy control of all bonding parameters

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Storage of 20 parameters

Easy setting recall for working on different applications

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Deep & Wide Bond Access

Ample workspace due to special bond head design

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Motorized Wire Clamp

Precise tail length control
Video

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Extension Kits

Pick & Place Kit, Pulltester,
Video Targeting, Copper Ball Bonding

Questions?

Get a quote now!

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Stephan Hausmann

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Distributors

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About TPT

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SalesSH

Stephan Hausmann

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Distributors

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About TPT

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Questions?

For more information contact us!

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Tobias Hickmann

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Youtube Channel

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Tobias Hickmann

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Youtube Channel

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Wire Bonder and Die Bonder Datasheets

Wire Bonder and Die Bonder Datasheets