HB02 Wire Bonder
Wedge-Wedge
HB05 Wire Bonder
Wedge-Wedge & Ball-Wedge
HB05 Wire Bonder
Wedge-Wedge & Ball-Wedge
4“ TFT
Multibutton Display
Fast Access
to all parameters
One Bond Head
for Wedge,
Ball, Bump,
& Ribbon
Deep & Wide
Bond Access - Ample work-
space due to Special
Bond Head Design
4“ TFT
Multibutton Display
Fast Access
to all parameters
Our long tested 4“control panel provides you with an intuitive entry bonding with our product. All processes are visible for you at any time.
One Bond Head
for Wedge,
Ball, Bump,
& Ribbon
With our machines there is no need to change the bond head, no matter the application. Just switch tool tips, fast and easy. All bonding modes are at your disposal any time.
Deep & Wide
Bond Access - Ample work-
space due to Special
Bond Head Design
We install extra-long bond arms/transducer in all our bonders. Further is the clamp and its screw installed on top of the tool instead of behind it. This unique combination is the key to access narrow spaces directly in the housing of your application.
17μm to 75μm Wire
gold, aluminum, silver
& copper wire
One Bond Head
wedge, ball, bump
& ribbon bonding
Light Weight
weighs in total
only 29kg
Compact Design
smooth and
easy use
4“ TFT
fast and easy control of
all bonding parameters
Storage of 20 parameters
easy setting recall for working
on different applications
Deep & Wide Bond Access
ample workspace due to
special bond head design
Extension Kits
Pick & Place Kit, Pulltester,
Video Targeting, Copper Ball Bonding
