Touch Screen
Easy Handling
and Control
with the 6,5" TFT
2000µm
Heavy
Ribbon
bonding
Deep & Wide
Bond Access - Ample work-
space due to Special
Bond Head Design
Touch Screen
Easy Handling
and Control
with the 6,5" TFT
Our long tested 6,5“control panel provides you with an intuitive entry bonding with our product. All processes are visible for you at any time.
2000µm
Heavy
Ribbon
bonding
Our HB30 can work with the most unusual wires to your satisfaction. Smaller production units are no problem at all.
Deep & Wide
Bond Access - Ample
workspace due to Special
Bond Head Design
We install extra-long bond arms/transducer in all our bonders. Further is the clamp and its screw installed on top of the tool instead of behind it. This unique combination is the key to access narrow spaces directly in the housing of your application.
H55 - Manual Pull Tester
for Heavy Wire Applications
Download PDF
Read MoreH55 - Manual Pull Tester
for Heavy Wire Applications
Our manual pull tester with drag pointer can quickly and easily check heavy wire bond connections up to 2000g.
To determine the bond quality of your application place the pull tester hook under a loop and pull the lever down.
Download PDF
Read More
Aluminum & Copper Wedge Bonding
wire sizes from 100µm to 500µm,
ribbon sizes up to 300µmx2000µm
Repeatable Loop Profiles
motorized axis allows
precise loop repetition
Touch Screen
easy handling and control
with the 6,5″ TFT
Automatic Bond Height Adjustment
z-axis sensor identifies touch down
and sets height parameters
Simple Loop Programming
create individual loop profiles
consisting of up to 10 steps
Storage of 100 parameters
easy setting recall for
working on different applications
Deep & Wide Bond Access
ample workspace due to
special bond head design
High Precision Cutting Sequence
specific wire cutting parameters
prevent substrate injury
Vacuum Stage Fixation
optional function for
high power applications
