HB30
Heavy Wire Bonder

With motorized
Z- & Y- Axes

Our goal is to support developers in realizing new ideas and applications for microelectronics. We developed the HB30 for applications with higher energy needs.

HB30 Heavy Wire Bonder

With motorized
Z- & Y- Axes

Our goal is to support developers in realizing new ideas and applications for microelectronics. We developed the HB30 for applications with higher energy needs.

Touch Screen

Easy Handling and Control with the 6,5

Our long tested 6,5“control panel provides you with an intuitive entry bonding with our product. All processes are visible for you at any time.

2000µm

Ribbon bonding

Our HB30 can work with the most unusual wires to your satisfaction. Smaller production units are no problem at all.

Deep & Wide

Bond Access
Ample workspace due to
Special Bond Head Design

We install extra-long bond arms/transducer in all our bonders. Further is the clamp and its screw installed on top of the tool instead of behind it. This unique combination is the key to access narrow spaces directly in the housing of your application.

HB30

Automatic Z- & Y- Axes best for smaller production units and unusual applications

1

Aluminum & Copper Wedge Bonding

wire sizes from 100µm to 500µm, ribbon sizes up to 300µmx2000µm

3

Repeatable Loop Profiles

motorized axis allows precise loop repetition

4

Touch Screen

easy handling and control with the 6,5″ TFT

5

Automatic Bond Height Adjustment

z-axis sensor identifies touch down and sets height parameters

6

Simple Loop Programming

create individual loop profiles consisting of up to 10 steps

7

Storage of 100 parameters

easy setting recall for working on different applications

8

Deep & Wide Bond Access

ample workspace due to special bond head design

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High Precision Cutting Sequence

specific wire cutting parameters prevent substrate injury

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Vacuum Stage Fixation

optional function for high power applications

Questions?

Get a quote now!

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Stephan Hausmann

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Stephan Hausmann

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About TPT

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Questions?

For more information contact us!

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Tobias Hickmann

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Wire Bonder and Die Bonder Datasheets

Wire Bonder and Die Bonder Datasheets