HB75
Die Bonder

With motorized
Z - Axis

With our Die Bonder HB75 die bonding tasks can be handled with ease and precise.

TPT Wire Bonder - Die Bonder - Diebonder HB75

TPT Wire Bonder - Die Bonder - Diebonder HB75 Überblick Overview Video Thumbnail

HB75 Overview Video

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TPT Wire Bonder - Die Bonder - Diebonder HB75 Tool Rotation Video Thumbnail

Tool Rotation Video

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TPT Wire Bonder - Die Bonder - Diebonder HB75 Broschüre Brochure Thumbnail

HB75 Brochure

06_01_TPT_ENG

HB75 Die Bonder

With motorized
Z - Axis

With our Die Bonder HB75 die bonding tasks can be handled with ease and precise.

TPT Wire Bonder - Die Bonder - Diebonder HB75

TPT Wire Bonder - Die Bonder - Diebonder HB75 Überblick Overview Video Thumbnail

HB75 Video

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TPT Wire Bonder - Die Bonder - Diebonder HB75 Tool Rotation Video Thumbnail

Tool Rotation

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TPT Wire Bonder - Die Bonder - Diebonder HB75 Broschüre Brochure Thumbnail

HB75 Brochure

06_01_TPT_ENG

Touch Screen

Easy Handling
and
Control with the 6,5" TFT

TPT Wire Bonder - Wire Bonder - Drahtbonder Touchscreen

Our long tested 6,5“control panel provides you with an intuitive entry bonding with our product. All processes are visible for you at any time.

3in1 Bond Head

Rotatable Bond Head
for changing from dispensing
to stamping and placing

TPT Wire Bonder - Die Bonder - Diebonder - rotierender Bondkopf Rotational Bond Head

HB75’s rotation bond head includes a pickup tool, a stamping tool and an epoxy dispenser.

Pick & Place

with integrated
vacuum
pump

TPT Wire Bonder - Die Bonder - Diebonder - integrierte Vakuum Pumpe integrated vacuum pump

With the HB75, picking up chips or small parts from the die carrier and its placement on the substrate is simple and accurate.

Touch Screen

Easy Handling
and
Control with the 6,5" TFT

TPT Wire Bonder - Wire Bonder - Drahtbonder Touchscreen

Our long tested 6,5“control panel provides you with an intuitive entry bonding with our product. All processes are visible for you at any time.

3in1 Bond Head

Rotatable Bond Head
for changing from dispensing
to stamping and placing

TPT Wire Bonder - Die Bonder - Diebonder - rotierender Bondkopf Rotational Bond Head

HB75’s rotation bond head includes a pickup tool, a stamping tool and an epoxy dispenser.

Pick & Place

with integrated
vacuum
pump

TPT Wire Bonder - Die Bonder - Diebonder - integrierte Vakuum Pumpe integrated vacuum pump

With the HB75, picking up chips or small parts from the die carrier and its placement on the substrate is simple and accurate.

Head
Configuration 1

Two tools
on manually
rotatable bond head

TPT Wire Bonder - Die Bonder - Diebonder HB75 Bond Kopf Konfiguration Configuration 1

Configuration for:
1 x Stamping Tool
1 x Pickup Tool

Head
Configuration 2

Four tools
on manually
rotatable bond head

TPT Wire Bonder - Die Bonder - Diebonder HB75 Bond Kopf Konfiguration Configuration 2

Configuration for:
2 x Stamping Tool
2 x Pickup Tool

Head
Configuration 3

Pickup tool
with additional
motorized rotation

TPT Wire Bonder - Die Bonder - Diebonder HB75 Bond Kopf Konfiguration Configuration 3

Configuration for:
1 x Stamping Tool
1 x Pickup Tool turnable

Head
Configuration 4

Epoxy
Dispenser
Kit

TPT Wire Bonder - Die Bonder - Diebonder HB75 Bond Kopf Konfiguration Configuration 4

Configuration for:
1 x Stamping Tool
1 x Pickup Tool
1 x Epoxy Dispenser Kit

Head
Configuration 1

Two tools
on manually
rotatable bond head

TPT Wire Bonder - Die Bonder - Diebonder HB75 Bond Kopf Konfiguration Configuration 1

Configuration for:
1 x Stamping Tool
1 x Pickup Tool

Head
Configuration 2

Four tools
on manually
rotatable bond head

TPT Wire Bonder - Die Bonder - Diebonder HB75 Bond Kopf Konfiguration Configuration 2

Configuration for:
2 x Stamping Tool
2 x Pickup Tool

Head
Configuration 3

Pickup tool
with additional
motorized rotation

TPT Wire Bonder - Die Bonder - Diebonder HB75 Bond Kopf Konfiguration Configuration 3

Konfiguration für:
1 x Stamping Tool
1 x Pickup Tool drehbar um die eigene Achse

Head
Configuration 4

Epoxy
Dispenser
Kit

TPT Wire Bonder - Die Bonder - Diebonder HB75 Bond Kopf Konfiguration Configuration 4

Configuration for:
1 x Stamping Tool
1 x Pickup Tool
1 x Epoxy Dispenser Kit

HB75

Semi-automatic
ideal for laboratories and pilot production lines

HB75

Semi-automatic
ideal for laboratories and pilot production lines
TPT Wire Bonder - Wire Bonder - Drahtbonder Pick & Place Thumbnail

Pick & Place

pick microchip from die-carrier
and place it to your surface

TPT Wire Bonder - Diebonder Die Bonder Drehbarer Bondkopf Rotatable Bond Head Thumbnail

Rotatable Bond Head

for quickly changing
between tools

TPT Wire Bonder - Diebonder Die Bonder Drehbarer Bondkopf Rotatable Bond Head Thumbnail  TPT Wire Bonder - Diebonder Die Bonder Motorisierte 90° linear Bewegung motorized Z-axis Thumbnail

True Vertical Z Movement

motorized Z-axis with
90° linear movement

TPT Wire Bonder - Wire Bonder - Drahtbonder Touchscreen Tumbnail

Touch Screen

easy handling and control
with the 6,5″ TFT

TPT Wire Bonder - Diebonder Die Bonder Epoxy Stempeln Stamping Thumbnail

Epoxy Stamping

fast and precise
stamping process

TPT Wire Bonder - Diebonder Die Bonder Epoxy Dispensen Dispending Thumbnail

Epoxy Dispensing

simple and
exact handling

Questions?

Get a quote now!

Questions?

Get a quote now!
TPT Wire Bonder - Wire Bonder - Drahtbonder - Die Bonder - Sales Stephan Hausmann

Stephan Hausmann

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TPT Wire Bonder - Wire Bonder - Drahtbonder - Die Bonder - Händler Distributors

Distributors

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TPT Wire Bonder - Wire Bonder/Drahtbonder/Die Bonder Logo

About TPT

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TPT Wire Bonder - Wire Bonder - Drahtbonder - Die Bonder - Sales Stephan Hausmann

Stephan Hausmann

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TPT Wire Bonder - Wire Bonder - Drahtbonder - Die Bonder - Händler Distributors

Distributors

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TPT Wire Bonder - Wire Bonder/Drahtbonder/Die Bonder Logo

About TPT

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Wire Bonder and Die Bonder Datasheets

Wire Bonder and Die Bonder Datasheets

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