HB100
R&D
Wire Bonder
with all Axes motorized and Bond Head Rotation
HB100
Automatic
Wire Bonder
With motorized Z-Y-X Axes and Bond Head Rotation
HB100
R&D Wire Bonder
with all Axes motorized
and
Bond Head Rotation
Equipped with software for research and development purposes (R&D) - the motorized Z-Y-X Axis and the rotatable Bond Head are the key to configure, safe and execute automatic Bond processes.
HB100
Automatic Wire Bonder
With motorized Z-Y-X Axes
and
Bond Head Rotation
Equipped with software for preproduction purposes - the motorized Z-Y-X Axis and the rotatable Bond Head are the key to configure, safe and execute automatic Bond processes.
Option
Pattern
Recognition
Teaser
One Bond Head
for Wedge, Ball,
Bump,
& Ribbon
Workspace
very large for bigger cases or multiple substrates
Option
Pattern
Recognition
Teaser
Bonding with TPT's automatic Wire Bonder HB100: Pattern Recognition and automatic bonding a series of chips on different substrates.
Teaser Video
Read MoreOne Bond Head
for Wedge, Ball,
Bump,
& Ribbon
With our machines there is no need to change the bond head, no matter the application. Just switch tool tips, fast and easy. All bonding modes are at your disposal any time.
Workspace
very large for bigger cases or multiple substrates
Big or unusual substrates and cases will have more then enough space on our HB100. Even better, combine it with one of our larger heater stages.
Bump Bonding
bumps applied
on microchip (flip chip)
Manual Bonding
aim on screen
with crosshair
Automatic Wire Bonder
motorized z-y-x axis and rotatable bond head for automatic bond processes
Pattern Recognition
automatic position correction
through machine vision
One Bond Head
wedge, ball, bump
& ribbon bonding
17µm to 75µm Wire
Ggold, aluminum, silver
& copper wire
Touch Screen
large 21″
highresolution TFT
Simple Loop Programming
create individual loop profiles
consisting of up to 10 steps
Automatic Bond Height Adjustment
z-axis sensor identifies touch down
and sets height parameters
Deep & Wide Bond Access
ample workspace due to
special bond head design
