HB100
R&D
Wire Bonder
with all Axes motorized and Bond Head Rotation
HB100
Automatic
Wire Bonder
With motorized Z-Y-X Axes and Bond Head Rotation
HB100
R&D Wire Bonder
with all Axes motorized
and
Bond Head Rotation
Equipped with software for research and development purposes (R&D) - the motorized Z-Y-X Axis and the rotatable Bond Head are the key to configure, safe and execute automatic Bond processes.
HB100
Automatic Wire Bonder
With motorized Z-Y-X Axes
and
Bond Head Rotation
Equipped with software for preproduction purposes - the motorized Z-Y-X Axis and the rotatable Bond Head are the key to configure, safe and execute automatic Bond processes.
Option
Pattern
Recognition
Teaser
One Bond Head
for Wedge, Ball,
Bump,
& Ribbon
Workspace
very large for bigger cases or multiple substrates
Option
Pattern
Recognition
Teaser
Bonding with TPT's automatic Wire Bonder HB100: Pattern Recognition and automatic bonding a series of chips on different substrates.
Teaser Video
Read MoreOne Bond Head
for Wedge, Ball,
Bump,
& Ribbon
With our machines there is no need to change the bond head, no matter the application. Just switch tool tips, fast and easy. All bonding modes are at your disposal any time.
Workspace
very large for bigger cases or multiple substrates
Big or unusual substrates and cases will have more then enough space on our HB100. Even better, combine it with one of our larger heater stages.
Bump Bonding
bumps applied
on microchip (flip chip)
![HB100_Bump_Bonding_01_ohne_BG_675_675 TPT Wire Bonder - Wire Bonder - Drahtbonder HB100 Bump Bonding](https://www.tpt-wirebonder.com/wp-content/uploads//00_Media/02_Drahtbonder/HB100/HB100_Bump_Bonding_01_ohne_BG_675_675-300x300.jpg)
Manual Bonding
aim on screen
with crosshair
![HB100_Manual_Mode_01_ohne_BG_675_675 TPT Wire Bonder - Wire Bonder - Drahtbonder HB100 Manuell Bonden Manual Bonding](https://www.tpt-wirebonder.com/wp-content/uploads//00_Media/02_Drahtbonder/HB100/HB100_Manual_Mode_01_ohne_BG_675_675-300x300.jpg)
![TPT_Icons_auto_ball TPT Wire Bonder - Wire Bonder - Drahtbonder Automatic Wire Bonder Automatischer Drahtbonder - Thumbnail](https://www.tpt-wirebonder.com/wp-content/uploads//00_Media/99_Elemente_und_Platzhalter/TPT_Icons_Pictos/TPT_Icons_auto_ball-75x75.png)
Automatic Wire Bonder
motorized z-y-x axis and rotatable bond head for automatic bond processes
![TPT_Icons_Pattern_Rec TPT Wire Bonder - Wire Bonder - Drahtbonder Pattern Recognition - Mustererkennung Tumbnail](https://www.tpt-wirebonder.com/wp-content/uploads//00_Media/99_Elemente_und_Platzhalter/TPT_Icons_Pictos/TPT_Icons_Pattern_Rec-75x75.png)
Pattern Recognition
automatic position correction
through machine vision
![2 TPT Wire Bonder - Wire Bonder - Drahtbonder Bondhead Bondkopf für Wedge, Ball, Bump, Ribbon bonden Tumbnail](https://www.tpt-wirebonder.com/wp-content/uploads//2019/07/2-75x75.jpg)
One Bond Head
wedge, ball, bump
& ribbon bonding
![1 TPT Wire Bonder - Wire Bonder - Drahtbonder 17µ bis 75µ Draht Wire Tumbnail](https://www.tpt-wirebonder.com/wp-content/uploads//2019/07/1-75x75.jpg)
17µm to 75µm Wire
Ggold, aluminum, silver
& copper wire
![4 TPT Wire Bonder - Wire Bonder - Drahtbonder Touchscreen Tumbnail](https://www.tpt-wirebonder.com/wp-content/uploads//2019/07/4-75x75.jpg)
Touch Screen
large 21″
highresolution TFT
![6 TPT Wire Bonder - Wire Bonder - Drahtbonder Loop Profil Loop Profile Software Thumbnail](https://www.tpt-wirebonder.com/wp-content/uploads//2019/07/6-75x75.jpg)
Simple Loop Programming
create individual loop profiles
consisting of up to 10 steps
![5 TPT Wire Bonder - Wire Bonder - Drahtbonder Automatisches Höhen Setup Automatic Bond Height Adjustment Thumbnail](https://www.tpt-wirebonder.com/wp-content/uploads//2019/07/5-75x75.jpg)
Automatic Bond Height Adjustment
z-axis sensor identifies touch down
and sets height parameters
![8 TPT Wire Bonder - Wire Bonder - Drahtbonder Deep & Wide Bond Access Thumbnail](https://www.tpt-wirebonder.com/wp-content/uploads//2019/07/8-75x75.jpg)
Deep & Wide Bond Access
ample workspace due to
special bond head design