Copper wires have bonding characteristics similar to gold, but have to be handled in an inert atmosphere due to the oxidation. Because of this effort copper wires are only used if there is a special requirement to do so.
A user-friendly alternative is copper wire with aluminum coating. This wire can be easily wedge bonded and has good storage characteristics.
- 25µ copper-wire (Cu-HC4) sputtered with a aluminum layer of 20 – 30 nm
- Standard 25µ gold wedge
- Semi-automatic wedge wire bonder HB16
Wedge bonds – slight copper color visible in the bond mark:
- The wire can be bonded & handled like 25µ gold wire.