Series Production
Series Production
One time and long-term agreements
Small to mid-series
TPT provides a range of Wire Bonding and Die Bonding services: Small and medium-scale production of wire bonding series enables flexible manufacturing solutions with high quality and efficiency. It is ideal for producing prototypes as well as smaller to medium order quantities.
Our portfolio includes the high-precision production of small and medium batches in Chip-on-Board (COB), Multi-Chip Module (MCM), and Chip-to-Chip technologies – without the need for fixed order quantities.
We usually process customer orders within 5 - 8 working days.
Our portfolio includes the high-precision production of small and medium batches in Chip-on-Board (COB), Multi-Chip Module (MCM), and Chip-to-Chip technologies – without the need for fixed order quantities.
We usually process customer orders within 5 - 8 working days.
| Material | Typical Wire Diameter | Cross-Section Shape | Bonding Method |
|---|---|---|---|
| Gold (Au) | 17–75 µm (typical: 25–30 µm) | Round | Ball Bonding, Wedge Bonding |
| Aluminum (Al) | 17–500 µm (typical: 25–300 µm) | Round, Flat (Ribbon) | Wedge Bonding |
| Copper (Cu) | 15–75 µm (typical: 25–50 µm) | Round | Ball Bonding, Wedge Bonding |
| Platinum (Pt) | 15–50 µm | Round | Wedge Bonding (rare) |
One time and long-term agreements
Small to mid-series
TPT provides a range of Wire Bonding and Die Bonding services: Small and medium-scale production of wire bonding series enables flexible manufacturing solutions with high quality and efficiency. It is ideal for producing prototypes as well as smaller to medium order quantities.
Our portfolio includes the high-precision production of small and medium batches in Chip-on-Board (COB), Multi-Chip Module (MCM), and Chip-to-Chip technologies – without the need for fixed order quantities.
We usually process customer orders within 5 - 8 working days.
| Material | Typical Wire Diameter | Cross-Section Shape | Bonding Method |
|---|---|---|---|
| Gold (Au) | 17–75 µm (typical: 25–30 µm) | Round | Ball Bonding, Wedge Bonding |
| Aluminum (Al) | 17–500 µm (typical: 25–300 µm) | Round, Flat (Ribbon) | Wedge Bonding |
| Copper (Cu) | 15–75 µm (typical: 25–50 µm) | Round | Ball Bonding, Wedge Bonding |
| Platinum (Pt) | 15–50 µm | Round | Wedge Bonding (rare) |
Wire bonding
17-500µm
Ball / Wedge
bonding
Bump
bonding
Ribbon
bonding
Die
bonding
Epoxy / Glue conductiv , non conductive
Encapsulation
Glob Top
Pull test, Shear test
Testing wire and die bond connections
Wire bonding
17-500µm
Ball and
Wedge bonding
Bump
bonding
Ribbon
bonding
Die
bonding
Epoxy / Glue conductiv , non conductive
Encapsulation
Glob Top
Pull test, Shear test
Testing wire and die bond connections
