Prototyping
Prototyping
Process development
Prototyping
TPT provides a range of Wire Bonding and Die Bonding services: Prototyping of wire bonding orders enables the rapid validation of design concepts and optimizes manufacturing efficiency. Through iterative testing, issues are identified early and solutions are implemented effectively.
Additional TPT services:
- Qualification of surfaces for bondability
- Pull and shear testing of third-party components
- Consulting
Additional TPT services:
- Qualification of surfaces for bondability
- Pull and shear testing of third-party components
- Consulting
Process development
Prototyping
TPT provides a range of Wire Bonding and Die Bonding services: Prototyping of wire bonding orders enables the rapid validation of design concepts and optimizes manufacturing efficiency. Through iterative testing, issues are identified early and solutions are implemented effectively.
Additional TPT services:
- Qualification of surfaces for bondability
- Pull and shear testing of third-party components
- Consulting
Wire bonding
17-500µm
Ball / Wedge
bonding
Bump
bonding
Ribbon
bonding
Die
bonding
Epoxy / Glue conductiv , non conductive
Encapsulation
Glob Top
Pull test, Shear test
Testing wire and die bond connections
Wire bonding
17-500µm
Ball and
Wedge bonding
Bump
bonding
Ribbon
bonding
Die
bonding
Epoxy / Glue conductiv , non conductive
Encapsulation
Glob Top
Pull test, Shear test
Testing wire and die bond connections
