HB75 Semiautomatic Die Bonder
Pick & Place
Pick Microchip from Die-Carrier and place it to your surface>>> watch Video <<<
Simple and exact handling
Fast and precise stamping process
for Quick Change between tools
True vertical Z movement
Motorized Z-axis with 90° linear movement
Microchip alignment thru the rotable work plate
Auto Vacuum Pump
integrated vacuum pump turns on automatically at Pick & Place.
optional heater stage
Up to 450 ° C heat, with programmable heating cycles
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