- 25µ gold wire, 100m on 2“ spool.
- Standard gold wedge tool.
- Semiautomatic Wedge-Wedge Wire Bonder HB16
- thread wire to the tip of wedge tool.
- program bond parameters and loop profile.
- after the second bond clamp closes, the wire is cut.
- it is recommended to heat up the bond surface to 120°C.
Advantages compared ball-wedge bonding:
- Bonding on very small bond pads.
- Flat and long loops are possible.
- Gold and aluminium wire
- Aluminium wire without heating.