25µ Gold Wedge-Wedge bonding


  • 25µ gold wire, 100m on 2“ spool.
  • Standard gold wedge tool.
  • Semiautomatic Wedge-Wedge Wire Bonder HB16


watch video
Bonding process:

  • thread wire to the tip of wedge tool.
  • program bond parameters and loop profile.
  • after the second bond clamp closes, the wire is cut.
  • it is recommended to heat up the bond surface to 120°C.

Advantages compared ball-wedge bonding:

  • Bonding on very small bond pads.
  • Flat and long loops are possible.
  • Gold and aluminium wire
  • Aluminium wire without heating.


Dowload PDF