6,5" Touch Screen
| Access & storage of all parameters. | ||
Ball & Wedge
| Ball, Wedge & Ribbon bonding with one Bond Head. |
Deep & Wide Access
| 165mm wide |
Automatic Bond Height Adjustment
| Z-axis sensor identifies touch down and sets height parameters. |
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Loop Profile Software
| Simple Loop Programming. |
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Electronic Wire Clamp
| Up & Down movement precise tail length control. |
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Parameter Storage
| Save bond parameters & loop profiles. |
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Motorized Wire Spool
| For large wire spools and consistent looping. |
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Stud Bump Bonding
| The bump size is electronically via the tail length and EFO volume adjustable. |
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Pick & Place Option
| Easy change from wire bonding to die bonding. |
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Accessories
