HB30 Heavy Wire Bonder

  • Aluminium & copper wedge bonding

    Wire sizes from 100µm to 500µm Ribbon sizes up to 300x2000µm

  • Repeatable Loop Profiles

    Motorised axis allows precise loop repetition

  • 6.5" Touch Panel

    6.5" Touch Panel provides easy control

  • Automatic bond height adjustment

    Z-axis sensor identifies touch down & sets height parameters

  • Simple Loop Programming

    Create individual loop profiles consisting of up to 10 steps

  • Storage of 100 parameters

    Storage & access of up to 100 parameter

  • Deep & Wide Bond Access

    Ample work space due to special bond head design

  • High precision cutting sequence

    Specific wire cutting parameters prevent substrate injury

  • Vacuum Stage Fixation

    Optional function for high power applications

  • Extension Kit compatibility

    Pick & Place and Video Targeting

  • Any questions? Contact us!