Equipment:

• 33µ copper wire, 100m at 2“ spool
• 33µ copper capillary and 33µ gold wedge
• Semiautomatic Wire Bonder HB16

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Ball Bonding process:

• it is important that the N² gas is on the tool during the EFO (TPT Copper Kit Option H47)
• need more Bond Force like Gold wire
• otherwise same process like Gold bonding.
• it is recommended to heat up bond surface up to 120°C.

Wedge Bonding process:

• need more Bond Force like Gold wire
• same process like Gold bonding.
• it is recommended to heat up bond surface up to 120°C.

Advantages over gold bonding:

• cheaper wire in mass production.
• better electronically conductivity.
• better thermal conductivity.

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