25µ Gold Ball-Wedge bonding
Equipment:
- 25µ gold wire, 100m at 2“ spool
- Standard 25µ capillary
- Semiautomatic Ball-Wedge Wire Bonder HB16
watch video
Bonding process:
- thread wire to the capillary.
- program bond parameters, ball size and loop profile.
- after second bond clamp is closes, wire is cut and ball is made by EFO (electronic flame off).
- it is recommended to heat up bond surface up to 120°C.
Advantages over wedge-wedge bonding:
- First bond connection more stable.
- Bonding may softer.
- The wire move vertically, that good for big height difference.
- Gold and copper wire possible.
