Equipment:

• 25µ gold wire, 100m at 2“ spool
• Standard gold wedge tool
• Semiautomatic Wedge-Wedge Wire Bonder HB16

watch video
                         
Bonding process:

• thread wire to the tip of wedge tool.
• program bond parameters and loop profile.
• after second bond clamp is closes, wire is cut.
• it is recommended to heat up bond surface up to 120°C.

Advantages over ball-wedge bonding:

• Bonding on very small bond pads
• Flat and long loops possible.
• Gold and aluminum wire
• Aluminum wire without heating.

Dowload PDF