25µ Gold Wedge-Wedge bonding

Equipment:

  • 25µ gold wire, 100m on 2“ spool.
  • Standard gold wedge tool.
  • Semiautomatic Wedge-Wedge Wire Bonder HB16

 

watch video
                          
Bonding process:

  • thread wire to the tip of wedge tool.
  • program bond parameters and loop profile.
  • after the second bond clamp closes, the wire is cut.
  • it is recommended to heat up the bond surface to 120°C.


Advantages compared ball-wedge bonding:

  • Bonding on very small bond pads.
  • Flat and long loops are possible.
  • Gold and aluminium wire
  • Aluminium wire without heating.

 

Dowload PDF