33µ Copper bonding

Equipment:

  • 33µ copper wire, 100m at 2“ spool
  • 33µ copper capillary and 33µ gold wedge
  • Semiautomatic Wire Bonder HB16

  
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Ball Bonding process:

  • It is important that the forming gas is flowing during the EFO (TPT Copper Kit Option H47).
  • Needs more Bond Force than Gold wire.
  • Same procedure as Gold bonding.
  • It is recommended to heat up the bond surface to 120°C.


Wedge Bonding process:

  • Needs more Bond Force than Gold wire.
  • Same procedure as Gold bonding.
  • It is recommended to heat up the bond surface to 120°C.


Advantages over gold bonding:

  • Cheaper wire in mass production.
  • Better electronical conductivity.
  • Better thermal conductivity.

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