Manual Wire Bonder
Motorized Z-Axis
Motorized Z- and Y-Axis
Heavy Wire Bonder up to 500µ wire
25µ gold wire Wedge-Wedge bonding.
3. Landshuter Symposium Mikrosystemtechnik13. und 14. März 2012
Nepcon Korea Seoul 11.-13. April 2012
IMAPS 2012 FranceGrenoble25. - 26. April 2012
SMT Hybrid Packaging Nuremberg, Germany 08.-10. May 2012
Expo Electronica Moscow Russia 11.-13. April 2012
ANM 20124th International conference on Advanced NanomaterialsChennai India 17. –19. October 2012
CIEN 2012 FranceParis23. –25. October 2012
MATELEC 2012 Spain23. –26. October 2012